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ICX405AL diagonal 6mm (type 1/3) ccd image sensor for ccir b/w video cameras description the ICX405AL is an interline ccd solid-state image sensor suitable for ccir b/w video cameras with a diagonal 6mm (type 1/3) system. compared with the conventional product icx055bl, basic characteristics such as sensitivity, smear, dynamic range and s/n are improved drastically. this chip features a field period readout system and an electronic shutter with variable charge-storage time. this chip is suitable for applications such as surveillance cameras, automotive cameras, etc. features high sensitivity (+4db compared with the icx055bl) low smear (?0db compared with the icx055bl) high d range (+3db compared with the icx055bl) high s/n low dark current excellent antiblooming characteristics continuous variable-speed shutter no voltage adjustment (reset gate and substrate bias are not adjusted.) reset gate: 5v drive horizontal register: 5v drive device structure interline ccd image sensor image size: diagonal 6mm (type 1/3) number of effective pixels: 500 (h) 582 (v) approx. 290k pixels total number of pixels: 537 (h) 597 (v) approx. 320k pixels chip size: 5.59mm (h) 4.68mm (v) unit cell size: 9.8m (h) 6.3m (v) optical black: horizontal (h) direction : front 7 pixels, rear 30 pixels vertical (v) direction : front 14 pixels, rear 1 pixel number of dummy bits: horizontal 16 vertical 1 (even fields only) substrate material: silicon ?1 e00608b28 sony reserves the right to change products and specifications without prior notice. this information does not convey any licens e by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. aaaaa a aaa a a aaa a a aaa a aaaaa pin 1 v 7 30 1 14 pin 9 h optical black position (top view) 16 pin dip (plastic) ? super had ccd is a trademark of sony corporation. the super had ccd is a version of sony's high performance ccd had (hole- accumulation diode) sensor with sharply improved sensitivity by the incorporation of a new semiconductor technology developed b y sony corporation.
2 ICX405AL block diagram and pin configuration (top view) 6 7 note) nc v 1 v 2 v 3 v 4 v dd gnd sub v l rg h 2 horizontal register vertical register 2 3 4 gnd 8 1 v out nc 10 11 12 14 9 16 13 15 nc 5 h 1 note) : photo sensor pin no. 1 2 3 4 5 6 7 8 v 4 v 3 v 2 v 1 gnd nc nc v out vertical register transfer clock vertical register transfer clock vertical register transfer clock vertical register transfer clock gnd signal output 9 10 11 12 13 14 15 16 v dd gnd sub v l rg nc h 1 h 2 supply voltage gnd substrate clock protective transistor bias reset gate clock horizontal register transfer clock horizontal register transfer clock symbol description pin no. description pin description symbol absolute maximum ratings ? 1 +24v (max.) when clock width < 10s, clock duty factor < 0.1%. against sub against gnd against v l between input clock pins storage temperature operating temperature 40 to +8 50 to +15 50 to +0.3 40 to +0.3 0.3 to +20 10 to +18 10 to +6 0.3 to +28 0.3 to +15 to +15 6 to +6 14 to +14 30 to +80 10 to +60 v v v v v v v v v v v v c c v dd , v out , rg sub v 1 , v 3 sub v 2 , v 4 , v l sub h 1 , h 2 , gnd sub v dd , v out , rg gnd v 1 , v 2 , v 3 , v 4 gnd h 1 , h 2 gnd v 1 , v 3 v l v 2 , v 4 , h 1 , h 2 , gnd v l voltage difference between vertical clock input pins h 1 h 2 h 1 , h 2 v 4 item ratings unit remarks ? 1
3 ICX405AL bias conditions clock voltage conditions dc characteristics item supply current i dd 35ma symbol min. typ. max. unit remarks item supply voltage protective transistor bias substrate clock v dd v l sub 14.55 15.0 ? 1 ? 2 15.45 v symbol min. typ. max. unit remarks ? 1 v l setting is the v vl voltage of the vertical transfer clock waveform, or the same power supply as the v l power supply for the v driver should be used. ? 2 do not apply a dc bias to the substrate clock pin, because a dc bias is generated within the ccd. item readout clock voltage v vt v vh1 , v vh2 v vh3 , v vh4 v vl1 , v vl2 , v vl3 , v vl4 v v v vh3 v vh v vh4 v vh v vhh v vhl v vlh v vll v h v hl v rg v rglh v rgll v rgl v rglm v rgh v sub 14.55 0.05 0.2 8.0 6.3 0.25 0.25 4.75 0.05 4.5 v dd +0.3 21.0 15.0 0 0 7.0 7.0 5.0 0 5.0 v dd +0.6 22.0 15.45 0.05 0.05 6.5 8.05 0.1 0.1 0.3 0.3 0.3 0.3 5.25 0.05 5.5 0.4 0.5 v dd +0.9 23.5 v v v v v v v v v v v v v v v v v v 1 2 2 2 2 2 2 2 2 2 2 3 3 4 4 4 4 5 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4) high-level coupling high-level coupling low-level coupling low-level coupling input through 0.1f capacitance low-level coupling low-level coupling horizontal transfer clock voltage reset gate clock voltage substrate clock voltage vertical transfer clock voltage symbol min. typ. max. unit waveform diagram remarks
4 ICX405AL r h r h h 2 h 1 c h1 c h2 c hh v 1 c v12 v 2 v 4 v 3 c v34 c v23 c v41 c v13 c v24 c v1 c v2 c v4 c v3 r gnd r 4 r 1 r 3 r 2 vertical transfer clock equivalent circuit horizontal transfer clock equivalent circuit r rg rg c rg reset gate clock equivalent circuit item capacitance between vertical transfer clock and gnd c v1 , c v3 c v2 , c v4 c v12 , c v34 c v23 , c v41 c v13 c v24 c h1 , c h2 c hh c rg c sub r 1 , r 3 r 2 , r 4 r gnd r h r rg 1500 1000 820 330 100 100 47 22 5 270 100 150 68 10 50 pf pf pf pf pf pf pf pf pf pf ? ? ? ? ? capacitance between vertical transfer clocks capacitance between horizontal transfer clock and gnd capacitance between horizontal transfer clocks capacitance between reset gate clock and gnd capacitance between substrate clock and gnd vertical transfer clock series resistor vertical transfer clock ground resistor horizontal transfer clock series resistor reset gate clock series resistor symbol min. typ. max. unit remarks clock equivalent circuit constant
5 ICX405AL drive clock waveform conditions (1) readout clock waveform (2) vertical transfer clock waveform ii ii 100% 90% 10% 0% v vt tr twh tf m 0v m 2 v 1 v 3 v 2 v 4 v vhh v vh v vhl v vhh v vhl v vh1 v vl1 v vlh v vll v vl v vhh v vh3 v vhl v vh v vhh v vhl v vl3 v vl v vll v vlh v vhh v vhh v vh v vhl v vhl v vh2 v vlh v vl2 v vll v vl v vhh v vhh v vhl v vh4 v vhl v vh v vl v vlh v vll v vl4 v vh = (v vh1 + v vh2 )/2 v vl = (v vl3 + v vl4 )/2 v v = v vh n v vl n (n = 1 to 4)
6 ICX405AL tr twh tf 90% 10% twl v h v hl (3) horizontal transfer clock waveform point a twl v rg v rgh v rgl v rglh rg waveform v rgll h 1 waveform twh tr tf 10% v rglm (4) reset gate clock waveform v rglh is the maximum value and v rgll is the minimum value of the coupling waveform during the period from point a in the above diagram until the rising edge of rg. in addition, v rgl is the average value of v rglh and v rgll . v rgl = (v rglh + v rgll )/2 assuming v rgh is the minimum value during the interval twh, then: v rg = v rgh v rgl negative overshoot level during the falling edge of rg is v rglm . (5) substrate clock waveform 90% 100% 10% 0% v sub tr twh tf m m 2 v sub (a bias generated within the ccd)
7 ICX405AL clock switching characteristics item readout clock vertical transfer clock reset gate clock substrate clock v t v 1 , v 2 , v 3 , v 4 h h 1 h 2 rg sub 2.3 37 11 1.5 2.5 41 5.6 15 2.0 38 75 42 5.6 79 0.5 12 0.012 0.012 6.5 15 0.5 15 0.5 10 0.012 0.012 4.5 250 15 0.5 s ns ns s ns s during readout ? 1 ? 2 during drain charge symbol twh min. typ. max. min. typ. max. min. typ. max. min. typ. max. twl tr tf unit remarks ? 1 when vertical transfer clock driver cxd1267an is used. ? 2 tf tr 2ns. horizontal transfer clock during imaging during parallel-serial conversion
8 ICX405AL 8 9 582 (v) 6 9 500 (h) v 10 h 8 h 8 v 10 effective pixel region ignored region zone 0, i zone ii, ii ' zone definition of video signal shading image sensor characteristics (ta = 25 c) item sensitivity saturation signal smear video signal shading dark signal dark signal shading flicker lag s vsat sm sh vdt ? vdt f lag 1080 1000 1350 115 98 20 25 2 1 2 0.5 mv mv db % % mv mv % % 1 2 3 4 4 5 6 7 8 ta = 60 c zone 0 and i zone 0 to ii ' ta = 60 c ta = 60 c symbol min. typ. max. unit measurement method remarks
9 ICX405AL image sensor characteristics measurement method measurement conditions 1) in the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) in the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black (ob) level is used as the reference for the signal output, and the value measured at point [ ? a] in the drive circuit example is used. definition of standard imaging conditions 1) standard imaging condition i : use a pattern box (luminance: 706cd/m 2 , color temperature of 3200k halogen source) as a subject. (pattern for evaluation is not applicable.) use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter and image at f8. the luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) standard imaging condition ii : image a light source (color temperature of 3200k) with a uniformity of brightness within 2% at all angles. use a testing standard lens with cm500s (t = 1.0mm) as an ir cut filter. the luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. sensitivity set to standard imaging condition i . after selecting the electronic shutter mode with a shutter speed of 1/250s, measure the signal output (vs) at the center of the screen and substitute the value into the following formula. 2. saturation signal set to standard imaging condition ii . after adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 200mv, measure the minimum value of the signal output. 3. smear set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 200mv. when the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective h blankings, measure the maximum value (vsm [mv]) of the signal output and substitute the value into the following formula. s = vs [mv] 50 250 sm = 20 log [db] (1/10v method conversion value) 500 1 200 ysm 10 1
10 ICX405AL ylag (lag) y signal output 200mv light fld v1 strobe light timing output 4. video signal shading set to standard imaging condition ii . with the lens diaphragm at f5.6 to f8, adjust the luminous intensity so that the average value of the signal output is 200mv. then measure the maximum (vmax [mv]) and minimum (vmin [mv]) values of the signal output and substitute the values into the following formula. sh = (vmax vmin)/200 100 [%] 5. dark signal measure the average value of the signal output (vdt [mv]) with the device ambient temperature 60 c and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. 6. dark signal shading after measuring 5, measure the maximum (vdmax [mv]) and minimum (vdmin [mv]) values of the dark signal output and substitute the values into the following formula. ? vdt = vdmax vdmin [mv] 7. flicker set to standard imaging condition ii . adjust the luminous intensity so that the average value of the signal output is 200mv, and then measure the difference in the signal level between fields ( ? vf [mv]). then substitute the value into the following formula. f = ( ? vf/200) 100 [%] 8. lag adjust the signal output value generated by strobe light to 200mv. after setting the strobe light so that it strobes with the following timing, measure the residual signal (vlag). substitute the value into the following formula. lag = (vlag/200) 100 [%]
11 ICX405AL cxd1267an 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 22/16v 0.1 7.0v 3.3/16v 1/35v 0.1 1m icx405 (bottom view) 15 14 13 12 11 10 12345 8 9 h 1 h 2 rg v l sub gnd v dd v 4 v 3 v 2 v 1 nc v out 22/20v ccd out 15v xsub xv2 xv1 xsg1 xv3 xsg2 xv4 h 1 h 2 1500p 100k 3.3/20v 0.01 7 gnd 100 3.9k 2sk523 rg 6 nc nc 16 1/20v 100k [ ? a] drive circuit
12 ICX405AL 900 800 700 600 500 wave length [nm] relative response 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.0 0.1 1000 400 unit : s odd field even field v1 v2 v3 v4 v1 v2 v3 v4 2.5 1.5 2.5 2.0 1.2 0.3 31.1 spectral sensitivity characteristics (excludes both lens characteristics and light source characteristics) sensor readout clock timing chart
13 ICX405AL hd 620 625 1 2 3 4 5 10 15 20 310 315 320 325 330 blk vd fld 25 335 340 v1 v2 v3 v4 ccd out 582 581 582 581 246 35 1 246 35 1 246 35 1 246 35 1 drive timing chart (vertical sync)
14 ICX405AL hd blk h1 h2 rg v1 v2 v3 v4 sub 490 495 500 1 2 3 5 10 15 20 25 30 1 2 3 5 10 15 16 1 2 3 5 7 1 2 3 5 drive timing chart (horizontal sync)
15 ICX405AL notes on handling 1) static charge prevention ccd image sensors are easily damaged by static discharge. before handling be sure to take the following protective measures. a) either handle bare handed or use non-chargeable gloves, clothes or material. also use conductive shoes. b) when handling directly use an earth band. c) install a conductive mat on the floor or working table to prevent the generation of static electricity. d) ionized air is recommended for discharge when handling ccd image sensor. e) for the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) soldering a) make sure the package temperature does not exceed 80 c. b) solder dipping in a mounting furnace causes damage to the glass and other defects. use a ground 30w soldering iron and solder each pin in less than 2 seconds. for repairs and remount, cool sufficiently. c) to dismount an image sensor, do not use a solder suction equipment. when using an electric desoldering tool, use a thermal controller of the zero cross on/off type and connect it to ground. 3) dust and dirt protection image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. clean glass plates with the following operation as required, and use them. a) perform all assembly operations in a clean room (class 1000 or less). b) do not either touch glass plates by hand or have any object come in contact with glass surfaces. should dirt stick to a glass surface, blow it off with an air blower. (for dirt stuck through static electricity ionized air is recommended.) c) clean with a cotton bud and ethyl alcohol if the grease stained. be careful not to scratch the glass. d) keep in a case to protect from dust and dirt. to prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) when a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. do not reuse the tape. 4) installing (attaching) a) remain within the following limits when applying a static load to the package. do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (this may cause cracks in the package.) compressive strength 50n cover glass plastic package 50n 1.2nm torsional strength aaaa aaaa aaaa aaaa aaaa aaaa
16 ICX405AL b) if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) the adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) the notch of the package is used for directional index, and that can not be used for reference of fixing. in addition, the cover glass and seal resin may overlap with the notch of the package. e) if the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) acrylate anaerobic adhesives are generally used to attach ccd image sensors. in addition, cyano- acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) others a) do not expose to strong light (sun rays) for long periods. for continuous using under cruel condition exceeding the normal using condition, consult our company. b) exposure to high temperature or humidity will affect the characteristics. accordingly avoid storage or usage in such conditions. c) the brown stain may be seen on the bottom or side of the package. but this does not affect the ccd characteristics. d) this package has 2 kinds of internal structure. however, their package outline, optical size, and strength are the same. structure a structure b chip metal plate (lead frame) package cross section of lead frame the cross section of lead frame can be seen on the side of the package for structure a.
ICX405AL package outline unit: mm 0.3 16 pin dip (450mil) h v 2.5 2.5 8.4 0.5 1.2 5.7 6.1 10.3 12.2 0.1 9.5 11.4 0.1 11.43 0.25 0? to 9? 8 1 16 9 2-r0.5 2.5 11.6 9.2 2.5 1.2 3.35 0.15 3.1 1.27 3.5 0.3 0.46 0.3 1.27 0.69 (for the first pin only) 1. ? is the center of the effective image area. 2. the two points ? of the package are the horizontal reference. the point ?' of the package is the vertical reference. 3. the bottom ? of the package, and the top of the cover glass ? are the height reference. 4. the center of the effective image area relative to ? and ?' is (h, v) = (6.1, 5.7) 0.15mm. 5. the rotation angle of the effective image area relative to h and v is 1?. 6. the height from the bottom ? to the effective image area is 1.41 0.10mm. the height from the top of the cover glass ? to the effective image area is 1.94 0.15mm. 7. the tilt of the effective image area relative to the bottom ? is less than 50 m. the tilt of the effective image area relative to the top ? of the cover glass is less than 50 m. 8. the thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. the notches on the bottom of the package are used only for directional index, they must not be used for reference of fixing. c b a d m b' ~ ~ ~ package structure package material lead treatment lead material package mass drawing number plastic gold plating 42 alloy as-c2.2-01(e) 0.90g sony corporation 17

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